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William moved himself and family to San Jose in 1967, and joined Philco, later acquired by Ford as its Ford Aerospace division, as an process engineer. His work was directed at the fabrication of high reliability electronic systems of thick film hybrid construction. For the uninitiated, this means special aluminum oxide ceramic wafers (or substrates), onto which conductive inks were used to connect chip components. Fired in a special furnance, the point would be to have electronics that could withstand the harsh environments of rocket launch and longterm space exposure.
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